Instrument Name: Fully Automatic Ion Sputtering Instrument Model: ETD-800

Principle: Bipolar DC Sputtering

Instrument Name: Ion Sputter Model: ETD-900M

Principle: Magnetron Sputtering

In magnetron sputtering, due to the Lorentz force exerted on moving electrons in a magnetic field, their trajectories may bend or even produce

Spiral motion increases the number of collisions with working gas molecules, leading to an increase in plasma density and a significant improvement in magnetron sputtering rate. It can also operate at lower sputtering voltages and pressures. At the same time, electrons that have lost energy through multiple collisions reach the anode and become low-energy electrons, thus preventing the substrate from overheating.

ETD-800 parameters:

Host specifications: 260mm × 307mm × 260mm (W × D × H)

Power specification: 220V/50HZ

Target (upper electrode): 50mm × 0.1mm (D × H)

Target material: Au

Vacuum sample chamber: borosilicate glass 115mm × 100mm (D × H)

Timer: maximum duration: 3600s

Mechanical pump: 1L/S

Zui High Voltage: -1200 DCV

ETD-900M parameters:

Host specifications: 300mm × 360mm × 380mm (W × D × H)

Target (upper electrode): 50mm × 0.1mm (D × H)

Target material: Au (standard)

Sample Room: Borosilicate Glass 160mm × 120mm (D × H)

Target size: 50mm

真空指示表： zui 高真空度： ≤ 4X10-2 mbar

Ionic ammeter: maximum current: 50mA

Timer: maximum duration: 0-360S 

Micro vacuum valve: can be connected to a 3mm hose

Gas can be introduced: various types

Zui High Voltage: -1600 DCV 

Mechanical pump: Standard configuration 2L/S (domestic VRD-8)

Characteristics and Applications:

ETD-800 Usage:

Preparation of scanning electron microscope (SEM) samples suitable for electron microscopy laboratories.

Features:

Fine particle coatings can be achieved by changing different target materials (gold, platinum, silver, etc.).

One click operation, easy to use.

ETD-900M Purpose:

Suitable for sample preparation in scanning electron microscopy (SEM) laboratories and electrode fabrication for non-conductive material experiments.

Features:

1. Simple, economical, reliable, and aesthetically pleasing.

2. The sputtering current and vacuum chamber pressure can be adjusted to control the coating rate and particle size.

3. The SETPLAYA manual start button can pre-set the pressure and sputtering current to avoid unnecessary damage to the film.

4. Vacuum protection can prevent equipment short circuits caused by low vacuum.

5. At the same time, different target materials (gold, platinum, iridium, silver, copper, etc.) can be replaced to achieve finer particle coatings.

6. By introducing different inert gases, a purer coating can be achieved.