1、 Scope of application

This device is suitable for conducting reliability tests such as IC characteristic analysis, high and low temperature cycle testing, temperature shock testing, and failure analysis on various semiconductor chips, flash memory/EMMC, PCB circuit board ICs, optical communication (such as transceiver transceiver high and low temperature testing, SFP optical module high and low temperature testing, etc.), electronics industry, etc.

2、 Technical parameters

Temperature range:- 80℃~+250℃

Temperature conversion speed: -55 ℃~+125 ℃/-125 ℃~-55 ℃ ≤ 10 seconds

Temperature accuracy: ± 0.5 ℃

Temperature resolution: 0.01 ℃

Equipment airflow rate: 4~18SCFM (1.9L/s~8.5L/s)

Measurement Mode: AIR MODE (Airflow Sensing) or DUT MODE (Speed End Measurement) Working Mode: High Temperature - Normal Temperature - Low Temperature/High Temperature - Low Temperature/High Temperature - Normal Temperature/Low Temperature - Normal Temperature/Custom Programming

Operation mode: manual/program/manual loop/automatic loop

Appearance dimensions: width 660mm, depth 1050mm, height 1000mm

Machine weight: 150KG

Arm extension size: 140cm

Maximum and minimum dimensions: 720~1220mm

Size of heat-resistant glass cover: inner diameter 140mm, height 55mm (can be customized according to product size)

Power supply: single-phase 220V, 50HZ, 40A

3、 Gas source requirements

Inlet temperature:+ 15℃~+25℃

Intake pressure: 90~110PSlG (6.2~7.6BAR)

Intake flow rate: 1-1.5m3/min

Inlet dew point: ≤ 10℃

Oil content: ≤ 0.01PPM