Model Features

1. The focused light spot is extremely small, allowing for ultra fine marking. The unique low-power laser beam is suitable for shallow marking of polymer materials and fragile thin materials.

2. By using ultraviolet short wavelength laser to directly break the molecular chains of substances, etching patterns can be revealed, with minimal heat affected area and no thermal effect, resulting in better material burning effect.

3. The high-energy molecules of ultraviolet light directly detach the molecules on the processed material, causing them to separate from the material. This method does not generate heat, and because it does not generate heat, ultraviolet laser processing becomes cold processing, which is also different from traditional lasers.

Sample Display