Silicon wafer polishing solutionSuitable for rough/medium polishing of semiconductor materials such as silicon wafers, its biggest feature is that it can be reused multiple times while having a high polishing removal rate (0.9 μ m/min). During the recycling process, the polishing removal rate and surface quality after polishing are stable, effectively reducing the cost of polishing solution. The micro roughness of the polished chip surface is below 0.2nm, which has been used in well-known polishing wafer production lines in China and fully meets the requirements of production applications. It can replace similar imported products from abroad.

Appearance: milky white or slightly blue transparent solution.

　　TECHNICAL INDEX

Content (calculated as SiO2%) -15% -25%

PH value -10.8-11.8

Specific gravity (20 ℃) -1.10-1.20

Particle size: 10nm-25nm

Viscosity (20 ° C) - less than 25c. p

　Our company develops polishing solutions for various materials through professional laboratories, and can configure polishing solutions according to different materials. Welcome to inquire by phone: