UV laser marking machine has better beam quality and smaller focused spot compared to fiber laser marking machine, which can achievehyperfineMarking. The materials suitable for processing are more extensive, the heat affected area is extremely small, there will be no thermal effect or material burning problem, the marking speed is fast, the efficiency is high, the overall performance is stable, the volume is small, and the power consumption is low, which has the advantages of a wider range of applications. High precision temperature control PID algorithm, which can choose multiple modes for first pulse suppression to achieve optimal suppression effect. Flexible control methods, full parameter internal and external control selection, suitable for customer control requirements of different applications.

The UV laser marking machine is developed using a 355nm UV laser

Advantages of UV laser marking machine:

High energy ultraviolet photons directly break the molecular bonds on the surface of many materials, causing molecules to detach from the object. This method does not generate high heat, and the concentrated spot of ultraviolet laser is extremely small, with almost no thermal impact during processing. Therefore, it is called cold processing and is suitable for ultra fine marking and engraving of special materials.

Industry applications:

Suitable for surface marking, micro hole processing, flexible PCB board, LCD, TFT marking, cutting, metal or non-metal coating removal, silicon wafer micro hole, blind hole processing on glass, polymer materials and other objects; Labeling and cutting of packaging bottles and flexible PCB boards for cosmetics, pharmaceuticals, and other polymer materials; Gifts, LCD glass QR code marking, surface drilling of glassware, metal surface coating marking, plastic buttons, electronic components, communication equipment, building materials, and more.