TS3500 Probe System

The TS3500 and TS3500-SE have the same functionality as MPI's well-known established TS3000 and TS3000-SE 300mm probe stations, and can be configured or upgraded with MPI's unique WaferWallet ™ And it has fully automated functions. MPI's solution reduces the overall testing cost for customers by providing fewer fully automated features than other suppliers' semi automated products. Advantages:

• Suitable for various wafer measurement applications
• Module Measurement - DC-IV, DC-CV, Pulse-IV, ESD, 1/f
• RF and Millimeter Wave -26 GHz to 110 GHz and above
• Reliability testing - precise stress testing
• Advanced testing control software suite
• Support temperature range -60 ° C to 300 ° C
• MPI ShielDEnvironment ™ Shielding environment
• A precision measurement environment designed specifically for EMI/RFI/Light Time shielding
• Support low leakage measurement at the aviation safety level
• Temperature measurement range -60 ° C to 300 ° C

WaferWallet ™

The common practice for device characterization in modeling and new technology development is to extract data from typical chips through extremely accurate IV-CV, 1/f, RF, mmW, and load tension measurements. WaferWallet from MPI ™ Expanded TS3500 series automation functions without affecting measurement capabilities. WaferWallet ™ There are five separate trays designed to manually load 150mm, 200mm, or 300mm "model" wafers ergonomically, allowing for fully automated testing with up to five identical chips at different temperatures.

Exchange of hot and cold silicon wafers

During wafer loading and unloading, it is no longer necessary to return the chuck to ambient temperature. Using WaferWallet ™， MPI maintains the chuck at any testing temperature through its unique wafer loading/unloading function, saving valuable time.

test automation

By using a notch indicator for simple and cost-effective manual coarse alignment, the initial wafer loading is fast and reliable. Depending on the operating method, other options include wafer pre aligner, ID reader, or PTPA function on TS3500-SE, all of which are additional features that enhance the level of automation.

SENTIO ® control system

MPI's SENTIO ® The 3.0 software suite with advanced GUI design is based on revolutionary patented technology: multi touch, intuitive operation; Single window GUI, similar to common mobile devices; Dashboard view of system status, which simplifies navigation; Intelligent and predictable operation guide; Free upgrade of the probe station's lifespan. Through WaferWallet ™ A simple view of the dashboard where the operator can identify loaded or empty trays, chip diameter (150 or 200 or 300 mm), plane/notch orientation, chip ID (if applicable), percentage of tested WaferMap, and more.