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MPI High Power Probe Station System
MPI High Power Probe Station System
Product details

TS2000-HP Probe System

MPI's TS2000-HP semi-automatic probe station testing system can provide high-power measurement of wafer devices of 8 inches and below, with advanced ShielDE environment ™ Can provide a low-noise and shielded testing environment.

  • Specially designed for high voltage and large current measurement applications
  • Suitable for wafer level high-power component measurement up to 10kV/600A (pulse)
  • Provide testing of high-power dynamic and static parameters under the carrier
  • Gold plating on the surface of the wafer stage to minimize contact resistance; Vacuum suction hole optimization, suitable for loading onto thin wafers up to 50 µ m thickness
  • Optional Taiko wafer stage
  • Provide anti arc solutions
  • MPI ShielDEnvironment ™ Shielding environment
  • A precision measurement environment designed specifically for EMI/RFI/Light Time shielding
  • Support low leakage measurement at the aviation safety level
  • Temperature measurement range -60 ° C to 300 ° C

Characteristics and advantages

security system

Adopting an interlockable safety light curtain, the instrument can be turned off through an interlocking system to protect users from accidental high-voltage impacts. The system has a backdoor and is protected by interlocking to provide easy initial security measurement settings.

ShielDEnvironment ™

MPI ShielDEnvironment ™ It is a high-performance micro dark room shielding system that provides excellent EMI and opaque shielding testing environment for ultra-low noise and low capacitance measurements. In order to prevent arcing between the chuck and the pressure plate, the TS2000-HP chuck is specially designed with ArcShield ™。

High Voltage Probe (HVP)

The low leakage probe is specially designed to withstand high voltages up to 10kV (coaxial) and 3kV (triaxial). Multiple connector options are available, such as Keysight Triax/UHV, Keithley Triax/UHV, SHV, or Banana.

High current probe (HCP)

A high-performance probe designed specifically for measuring high current chips up to 200A (pulse). The MPI multi finger high current probe adopts a single-chip structure, which can effectively handle high currents and provide low contact resistance.

High power testing system

This testing system provides an integrated solution for characterizing 2-pole and 3-pole power devices, such as field-effect transistors (FETs), bipolar junction transistors (BJTs), diodes, and capacitors (up to 3 kV and 100 A). As long as a DUT is inserted, all relevant parameters and characteristic capacitance (Ciss, Coss Crss) of the disconnected and connected states can be measured. The IV characteristic can be performed in pulse mode or DC mode. This can improve efficiency and prevent any rewiring errors.

Ultra fast dynamic RDS (on)

Characterization System of GaN Devices

The ultra fast dynamic RDS (on) test is designed to characterize the characteristics of GaN transistors. A key requirement of power electronics is to immediately achieve a very low on resistance (RON) after switching from a high voltage off state to a low voltage on state. The ultra fast dynamic RDS (on) test can immediately measure RDS (on) after switching between closed and open states. The first RDS (on) value is generated after approximately 1 us. This system is designed for voltages up to 100A (pulse current) or up to 1kV. Due to the special design of the probe, it can measure more parameters (leakage or other).

Automated wafer loading system

The automated single-chip loader and safety testing management provide unique features that can load/unload chips at any temperature. Loading or unloading chips no longer requires cooling or heating to ambient temperature. This can save a lot of downtime and significantly improve the overall efficiency of the MPI testing system, while the convenient administrator login process can protect necessary settings.

Optional anti arc liquid tray

Specially designed anti arc liquid tray can be used to suppress arcs by simply placing it on the surface of high-power chucks. The wafer can be safely placed in a tray and immersed in liquid for arc free high-voltage testing.

Software Suite SENTIO ®

The MPI automatic engineering probe system is controlled by a unique and revolutionary multi touch operation SENTIO ® The software suite, with its simple and intuitive operation, saves a lot of training time. The commands of 'scroll', 'zoom', and 'move' mimic modern smart mobile devices, allowing everyone to become an expert in just a few minutes. Switching between the active application and other apps only requires simple finger operations.

For RF application systems, there is no need to switch to another software platform - MPI RF calibration software program QAlibria ® With SENTIO ® Fully integrated together, following a single operational concept approach, easy to use.

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