completeNew precision research all-in-one machine

Electron microscope sample preparation equipmentLEICA EM TXP is a surface treatment tool that can accurately locate target areas, especially suitable forSEM，TEMandLMCut the sample before observationPolishing and other series of treatments. It is particularly suitable for preparing high difficulty samples, such as those that require precise target localization or targeted processing of small targets that are difficult to observe with the naked eye. have gotLeica EM TXPThese tasks can be easily completed.

InLeica EM TXPPreviously, performing fixed-point cutting, grinding, or polishing on the target area was usually a time-consuming, labor-intensive, and difficult task because the target area was easily lostOr it may be difficult to handle due to the target size being too small. useLeicaEM TXPSuch samples can be easily processed.

Furthermore, leveraging its multifunctional features,Leica EM TXPIt is also an efficient pre sample preparation tool that can serve ion beam grinding technology and ultra-thin slicing technology.

Electron microscope sample preparation equipment

Integrate with the observation system

Observing the entire sample processing process and target area under a microscope, the sample is fixed on a sample cantilever. During the sample processing, real-time observation of the sample can be achieved through a stereo microscopeObserve, observe from an angle0°to60°Adjustable, or tuned to-30°Distance measurement can be performed using the eyepiece ruler.Leica EMTXPIt also has a bright circular shapeLEDLight source illumination, toObtain a visual observation effect.

>Accurate positioning and sample preparation of small target areas

>In situ observation through stereomicroscope

>Multi functional mechanical processing

>Automated sample processing process control

>Can achieve a mirror like polishing effect

> LEDThe brightness of the circular light source can be adjusted,4Segments are optional

Born for microscale sampling

Localization, cutting, grinding, and polishing of small targets at the millimeter and micrometer scales is a challenging task, mainly due to the following difficulties:

>The target is too small to be easily observed

>It is difficult to accurately locate targets or calibrate their angles

>Grinding and polishing to the target position often require a lot of manpower and time

>Small targets are easily lost

>The sample size is small and difficult to operate, often requiring embedding and embedding

Integrated Microscopic Observation and Imaging System

Leica M80Stereomicroscope

>Parallel light path design: A parallel light path is formed through the central main objective mirror, with a consistent focal plane

>High magnification resolution: image quality and stable light intensity available at all zoom ratios

>Ergonomic design: comfortable to use *, without muscle tension and fatigue

Leica IC80 HDhigh-definition camera

>Seamless design: Installed between the optical head and binocular tube, no need to add a picture tube or photoelectric tube

>High quality images: coaxial optical path with microscope ensures image quality and obtains non reflective images

>Provide dynamic high-definition images that can be used with or without a computer connection

4 Adjustable brightness of segmented sectionsLEDring light

>Illumination from different angles reveals tiny details of the sample

Leica Application Suite (LASImage measurement and analysis software)*

>Realize digital imaging

>Can process and analyze images

Multiple methods for preparing and processing samples

Samples do not need to be transferred, just switch tools

There is no need to transfer the sample back and forth, simply changing the tool used to process the sample can complete the sample processing process, and the entire sample processing process can be observed in real time through a microscope. For safety reasons, the workshop where the tools and samples are located is equipped with a transparent safety cover, which can prevent the operator from accidentally touching the moving parts during sample processing and also prevent debris from splashing.

LEICA EM TXPThe sample can be processed as follows:

>milling

>cutting

>grinding

>polishing

>Chong Diamond

Sample preparation process

Electron microscope sample preparation equipment?Application examples

（1）Yes, that's rightPCBProcess the cross-section of the through-hole in the board

（2）Yes, that's rightICFixed point cutting and polishing treatment of Zhongjin wire welding points

（3）Particle samples are not embedded and stuck on the sample stage for sample preparation

（4）Nut and nut in watch

（5）Minor defects on chrome plated devices