Shenzhen Yihexing Electromechanical Technology Co., Ltd
Home>Products>IC electronic low-temperature baking and drying cabinet
Firm Information
  • Transaction Level
    VIP member
  • Contact
  • Phone
    13560710910
  • Address
    No. 6255 Longgang Avenue, Yihe Industrial Park, Henggang Street, Longgang District, Shenzhen City
Contact Now
IC electronic low-temperature baking and drying cabinet
The Yihexing low-temperature baking series moisture-proof cabinet combines ultra-low dehumidification technology and low-temperature baking, fully mee
Product details

Product FeaturesPRODUCT FEATURES

BGA electronic component low moisture resistant boxes have more stringent regulatory standards for the exposure of humidity sensitive components (MSD) in the environment. When exposed for a longer period of time than allowed, it will cause moisture to adhere and infiltrate into electronic components. On the other hand, due to the implementation of ROHS regulations for lead-free processes, the welding temperature will be increased, which makes it easier for moisture inside electronic components to expand and burst due to instantaneous high temperatures.

Yihexing BGA electronic components' low moisture box, combined with ultra-low dehumidification technology and low-temperature baking, fully meets the environmental requirements of 40 ℃+5% RH. This model is particularly recommended for PCB packaging factories to store unused SMD parts in low humidity and perform low humidity and low-temperature baking treatment before packaging, greatly improving the packaging yield rate.


1.1 Stimulate internal moisture: Combining the dual characteristics of baking and dehumidification, fully excite the surface and deep water molecules inside electronic components, making them completely dry. This machine uses a low temperature of 40 ℃ to force water molecules to evaporate from the inside of the parts, and then the dehumidification host completely absorbs the water molecules in the air inside the cabinet and discharges them outside. The dryness can reach below 5% RH. Not only does it completely avoid the potential thermal damage and oxidation of electronic components during traditional 125 ℃ oven baking, but it also solves the problem of moisture reattaching to the components after cooling.


1.2 Solving the problem of "false drying": Many defective parts often come from "false drying", which means that when the external environment is low temperature, although the surface of electronic parts has been completely dried, the deep water molecules inside the parts have not been removed and cannot be detected by instruments. After the parts are welded online, the deep water molecules inside will expand due to heat, resulting in the phenomenon of bursting and empty welding. This machine can completely solve this problem.


1.3 Double layer cabinet: The insulation design of the cabinet can achieve good insulation effect and prevent temperature loss. The temperature is evenly distributed throughout the cabinet, saving energy and quickly dehydrating to achieve drying effect, quickly restoring the floor life.


1.4 Temperature and humidity reading function: Simply connect the computer to the Rj45 port on the machine to record temperature and humidity data. Not only is it convenient for users to monitor temperature and humidity changes, control the use of the machine, but it can also determine whether the machine is operating normally. This function provides users with a temperature and humidity management mode, replacing the previous manual recording method, and allowing them to access and trace historical data at any time.


1.5 Temperature and Humidity Central Monitoring System: It can dynamically monitor multiple devices in real-time, with functions such as real-time display, recording, recall, and alarm of data/curves. The temperature and humidity recording data can be converted into Excel format and output for printing.


1.6 Alarm Function: There are warning lights and alarms inside the cabinet, and the upper limit and delay values of temperature and humidity can be set individually. When the temperature and humidity inside the cabinet exceed the upper limit value, this model will immediately activate or delay the activation of the warning lights or alarms based on the set values.


Core advantagesCORE CONFIGURATION


① Some MSD material strips and trays are not suitable for high-temperature baking. If the materials are removed first and then baked, the efficiency is very low.
② Some SMD devices and motherboards cannot be baked at high temperatures for a long time.
③ For other SMD devices, the higher the temperature, the more severe the aging of MSD. Even if it can withstand prolonged high-temperature baking, it still has the potential for thermal damage and easy oxidation, or the formation of intermetallic compounds at the internal connections of the device, which affects the solderability of the device.
④ High temperature baking can only be carried out once, and it must be processed and used immediately after baking to prevent the device from repeatedly absorbing moisture.


Three major advantages of BGA electronic component low moisture-proof box for storing products
① No need for pre baking: can prevent the occurrence of various potential defective products
② Gentle baking: No damage to various SMD during dehumidification
③ Moisturizing effect: can prevent stored items from absorbing moisture within one hour after leaving the box


Product parametersPRODUCT PARAMETERS

scope of application

Scope of application


Online inquiry
  • Contacts
  • Company
  • Telephone
  • Email
  • WeChat
  • Verification Code
  • Message Content

Successful operation!

Successful operation!

Successful operation!