1、 Instrument Introduction

High temperature contact angle measuring instrument for testing the interface performance of high-temperature and high vacuum gauges

High temperature contact angle tester is a specialized scientific research device used to study the variation of contact angle between different melts and corresponding substrates at high temperatures. It can achieve surface and interface performance testing of materials under high temperature and high vacuum conditions. This instrument is capable of visualizing and quantitatively characterizing the shrinkage, deformation, melting, wetting, spreading, and solidification behavior of low melting point materials during the heating and cooling processes.

The whole machine adopts a modular and modular structure design: a specially designed ultra-high temperature furnace, a precision mechanical adjustment structure for the sample stage, an optical imaging system, a CCD imaging system, and professional analysis software; Simultaneously compatible with vacuum control system, atmosphere control system, and unique oxygen control system

1. High temperature: Actual temperature 1600 ℃

2. High vacuum: Vacuum degree 1 × 10^-3Pa

3. Low oxygen content: Control the oxygen content in the atmosphere to be less than 10^-2ppm

4. Image acquisition: Acquisition speed ≥ 30 frames per second, continuous image recording throughout the entire process

5. Intelligent image analysis and data processing software: automatic continuous calculation of parameters such as high-temperature melt contact angle θ, diameter d, height h, and volume v

2、 Main functions

1. Static measurable liquid/Fixed contact angle can also dynamically measure the variation of contact angle with time or temperature during the temperature rise and fall process;

2. Contact angle θ and droplet diameter D can be obtained onlineParameters such as droplet height H and droplet volume V are used to calculate the surface tension of the melt and evaluate its wettability on the substrate material.

3. It can achieve experimental measurement of characteristic parameters of powder, billet, and bulk materials (such as sintering temperature, softening temperature, melting point, etc.), guiding the formulation and optimization of sintering processes for ceramics and powder metallurgy products;

4. The deformation of samples with regular or irregular shapes during the sintering process can be measured and recorded, and compared with the microstructure evolution process, it can provide a deeper understanding of the sintering process mechanism;

5. Can achieve the above multiple parameters at room temperature~1600The measurement within the temperature range of ℃ can achieve process analysis of complex heat treatment processes through 30 program settings.

3、 Application area

1. Research and development, screening, and optimization of new sintering additivesMonitor the deformation, softening, sintering, and contour changes of ceramic materials during the heating process until melting.

2. Research on Ceramic/Metal PackagingAnalyze the wettability and solderability of solder and substrate, and design solder reasonablyIngredients to improve packaging strength.

3. Analysis of characteristic temperature points and melting behavior of new alloys/composite materials/glass/ceramics

4. Research and development of high-temperature functional coatings：Research on the Corrosion and Penetration Resistance of Coatings, Resistance to CMASCorrosion coating, etc

5. Research on Solid Waste UtilizationResearch on solid waste utilization in industries such as steel, coal, and electricity, development of slag cleaning agents, high temperature performance of copper slag, pre melted slag, calcium slag balls, etc

Wetting behavior of high-temperature melt and functional coating substrate

Counterfeiting of patented products will be prosecuted

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