Structural diagram of microcirculation reflow soldering equipment in eight temperature zones

Performance characteristics of microcirculation reflow soldering equipment in eight temperature zones

To extend the service life of the motor, our company's technical personnel specialize in design; Promote internal cooling circulation convection to lower the temperature around the motor to around 38 ℃;

High quality high-temperature and high-speed motors operate smoothly, with minimal vibration and low noise;

Professional wind turbine design, stable wind speed, effectively preventing the uniformity of wind when the PCB board is heated, achieving high repeated heating;

Each temperature zone adopts forced independent circulation, independent PID control, and up and down independent heating methods to ensure accurate and uniform furnace temperature and large heat capacity;

An online UPS equipped with power-off protection function ensures normal output of the PCB board after power failure, without damage;

● Independently controlled cooling system, forced air cooling; The temperature of the PCB board after production is ≤ 50 ℃;

The insulation layer is made of high-quality aluminum silicate insulation material, and the furnace is designed with multiple layers of insulation. The surface temperature of the furnace body is about 5 degrees higher than the ambient temperature, effectively reducing the working environment temperature. The insulation effect is good, the temperature rises quickly, and the temperature from room temperature to working temperature is ≤ 20 minutes; Special furnace liner design, low power consumption;