Combining over a decade of specialized knowledge in packaging optical properties, the CONTESSP large panel metrology system has increased the measurement throughput of high-density interconnect PCB (HDI PCB) substrates by more than double compared to the previous generation WLI instruments. This system is specifically designed to measure every layer of PCB panels during the manufacturing process and includes a range of advanced features, providing the semiconductor packaging industry with maximum production performance, convenience, reliability, and throughput. The Confee SP with gauge capability uses an intuitive production interface that provides fast and easy benchmark alignment and configurable user input.

Mismatched essencelinear measure

With its new vibration resistant system design and brick like Wyko vertical scanning interferometry (VSI) imaging, the Contracsp system with gauge capability performs extremely accurate three-dimensional critical dimension (CD) measurements at nanometer resolution. This ability, coupled with extensive automation, enables ContracsSP to multitask, serving as both a powerful surface texture metrology instrument and an easy-to-use defect detection tool.

Streamlined operation and analysis

The intuitive production interface of Confoe SP provides fast and simple benchmark alignment and configurable user input. In addition to transmission/failure information, users can now select detailed parameter results for display on the summary screen. The Vision 64 software provides complete access control for engineers, technicians, and operators, with simple coordination file import functionality, ensuring system to system recipe portability and fast file creation.

Large measurable area suitable for panel measurement

The system utilizes Bruker's gantry based design and integrated workstation to support up to 600x600mm samples with highly compact footprints. Software specifically designed for production panel metrology helps manufacturing engineers and operators fully utilize unique optical profile features, including dynamic signal segmentation, re measurement functionality, terrain scanning to compensate for wafer bows, coordinate file import ESD、 Panel ID reading and pattern recognition.